What are the advantages of thermally conductive potting adhesives?

Electronic products in the production process, often used in the potting process. Potting glue is often used to protect electronic and electrical components, which can play the role of moisture-proof, dust-proof, anti-corrosion, and shock-proof. Some potting adhesives with special requirements help to density, miniaturize and improve the reliability of electronic products.

Why choose thermally conductive potting adhesive?

High thermal conductivity helps electronic components dissipate heat faster. Thermally conductive filler is the leading thermal conductivity carrier; in the form of particles or fibers, its thermal conductivity is much more excellent than the matrix material. When the filling amount of thermally conductive filler is small, the contribution to the overall thermal conductivity system is not too large. When the filling amount reaches a critical point, the filler contacts each other and forms a chain-like and network-like structure in the system, forming a thermally conductive network chain. When the orientation of these thermally conductive chains is parallel to the direction of heat flow, it can improve the thermal conductivity of the whole system to a large extent.

Classification of thermally conductive adhesives

The addition of thermally conductive fillers will often substantially enhance the thermal conductivity of potting adhesives, as long as they include the following five categories.

(1) silica micronized powder is a commonly used thermally conductive filler called crystalline silica micronized powder. Because of its low cost, it is used in large quantities in ordinary potting compounds.

(2) Alumina: good insulation, high thermal stability, and high thermal conductivity, but its larger density limits its application in high-end industries and does not meet the requirements of lightweight.

(3) aluminum hydroxide: this is a filler that can meet both thermal conductivity and flame retardancy, and it has a low density and high volume filling. AL (OH)3 is an amphoteric compound with poor acid and alkali resistance, and its thermal stability is also poor due to its low melting point.

(4) boron nitride, aluminum nitride: these two belong to the higher thermal conductivity of the filler, but the price is high, add up to trouble, easy to hydrolyze in water.

(5) other semi-conductive and conductive fillers: conductive fillers, including aluminum powder, copper powder, silver powder, and other metal powder. These powders can be used in combination with insulating thermal conductive fillers and semi-conductive fillers, including graphene.

What are the uses of thermally conductive potting adhesive?

It is suitable for electronic parts thermal conductivity, insulation, waterproof and flame-retardant, and its flame retardancy should reach UL94-V0 level. To meet the requirements of the EU ROHS Directive. The main application areas are electronic, electrical components, and electrical components potting, also used for similar temperature sensor potting and other occasions.

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